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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9309373 B1

PDFFull Text
Date of Patent:
Apr. 12, 2016

Filed:

Dec. 02, 2011

Adhesive composition and thermally adhesive member using same

Applicants:

Takahiro Ito, Toyama, JP;

Makoto Imahori, Toyama, JP;

Tatsuo Nishio, Tokyo, JP;

Inventors:

Takahiro Ito, Toyama, JP;

Makoto Imahori, Toyama, JP;

Tatsuo Nishio, Tokyo, JP;

Assignee:

TOAGOSEI CO., LTD., Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Susannah Chung

Assistant Examiner:

Josephine Chang

Int. Cl.
CPC ...
C08K 5/07 (2006.01); C08K 5/01 (2006.01); C09J 151/06 (2006.01); B32B 7/12 (2006.01); C08G 18/62 (2006.01); C08G 18/79 (2006.01); C09J 175/04 (2006.01); C09J 123/16 (2006.01); B32B 15/08 (2006.01); C08F 255/02 (2006.01); C08F 255/04 (2006.01); C08L 51/06 (2006.01); C09J 123/28 (2006.01);
U.S. Cl.
CPC ...
C08K 5/01 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); C08F 255/02 (2013.01); C08F 255/04 (2013.01); C08G 18/6204 (2013.01); C08G 18/791 (2013.01); C08K 5/07 (2013.01); C08L 51/06 (2013.01); C09J 123/16 (2013.01); C09J 151/06 (2013.01); C09J 175/04 (2013.01); C08L 2205/025 (2013.01); C09J 123/286 (2013.01);
Abstract

Provided is an adhesive composition leading to sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Also provided is an adhesive composition having excellent heat resistance (heat resistant adhesion) in the bonded part of a composite body obtained by joining a polyolefin resin-formed body and other member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130° C., and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120° C. to 170° C.

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