The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Nov. 03, 2010
Applicants:

Izabela Janowska, Strasbourg, FR;

Dominique Begin, Achenheim, FR;

Kambiz Chizari, Calgary, CA;

Ovidiu Ersen, Strasbourg, FR;

Pierre Bernhardt, Heiligenberg, FR;

Thierry Romero, Strasbourg, FR;

Marc Ledoux, Strasbourg, FR;

Cuong Pham-huu, Strasbourg, FR;

Inventors:

Izabela Janowska, Strasbourg, FR;

Dominique Begin, Achenheim, FR;

Kambiz Chizari, Calgary, CA;

Ovidiu Ersen, Strasbourg, FR;

Pierre Bernhardt, Heiligenberg, FR;

Thierry Romero, Strasbourg, FR;

Marc Ledoux, Strasbourg, FR;

Cuong Pham-Huu, Strasbourg, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C01B 31/02 (2006.01); C01B 31/04 (2006.01); H01B 1/04 (2006.01); C08K 5/00 (2006.01); B02C 19/18 (2006.01); B82Y 40/00 (2011.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
C01B 31/0206 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01B 31/0469 (2013.01); C01B 2204/04 (2013.01); C01B 2204/22 (2013.01); C01B 2204/28 (2013.01); C01B 2204/32 (2013.01);
Abstract

The preparation of graphene, mono-, bi- and multi-layers from graphite-based precursor materials, for example, pencil lead or graphite, by a method of mechanical thinning on the surface of a planar substrate with controlled roughness, followed by sonication in order to collect the graphene deposited on the substrate in a liquid medium. The bearing force during thinning by mechanical friction enables the number of graphene sheets deposited on the surface of the substrate to be controlled.


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