The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Nov. 22, 2011
Applicants:

Tomoyuki Ishida, Itami, JP;

Hideki Moriguchi, Itami, JP;

Takeru Nakashima, Itami, JP;

Satoru Kukino, Itami, JP;

Shinichiro Yurugi, Itami, JP;

Teruhiro Enami, Itami, JP;

Katsumi Okamura, Itami, JP;

Yusuke Matsuda, Itami, JP;

Koji Sano, Itami, JP;

Keizo Kobayashi, Nagoya, JP;

Kimihiro Ozaki, Nagoya, JP;

Inventors:

Tomoyuki Ishida, Itami, JP;

Hideki Moriguchi, Itami, JP;

Takeru Nakashima, Itami, JP;

Satoru Kukino, Itami, JP;

Shinichiro Yurugi, Itami, JP;

Teruhiro Enami, Itami, JP;

Katsumi Okamura, Itami, JP;

Yusuke Matsuda, Itami, JP;

Koji Sano, Itami, JP;

Keizo Kobayashi, Nagoya, JP;

Kimihiro Ozaki, Nagoya, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22C 1/02 (2006.01); B32B 15/16 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); B23K 20/233 (2006.01); B23K 31/02 (2006.01); B23K 35/00 (2006.01); B23K 35/30 (2006.01); C22C 9/00 (2006.01); C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
B32B 15/16 (2013.01); B23K 1/0004 (2013.01); B23K 1/0008 (2013.01); B23K 1/19 (2013.01); B23K 20/023 (2013.01); B23K 20/16 (2013.01); B23K 20/233 (2013.01); B23K 31/025 (2013.01); B23K 35/001 (2013.01); B23K 35/302 (2013.01); B23K 35/3033 (2013.01); C22C 1/02 (2013.01); C22C 1/023 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01); B23B 2222/88 (2013.01); B23B 2224/36 (2013.01); B23B 2226/125 (2013.01); B23B 2240/08 (2013.01); B23K 2201/20 (2013.01); B23K 2203/18 (2013.01); Y10T 403/479 (2015.01);
Abstract

A joined product has a cemented carbide sintered compact serving as a first material to be joined and a cBN sintered compact serving as a second material to be joined, wherein: the first material to be joined and the second material to be joined are joined together via a joining material disposed therebetween and containing titanium (Ti); and a titanium nitride (TiN) compound layer having a thickness of 10-300 nm is produced at an interface between the second material to be joined and the joining material.


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