The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Feb. 02, 2010
Applicants:

D. Scott Thompson, Woodbury, MN (US);

Larry D. Boardman, Woodbury, MN (US);

Catherine A. Leatherdale, Woodbury, MN (US);

Inventors:

D. Scott Thompson, Woodbury, MN (US);

Larry D. Boardman, Woodbury, MN (US);

Catherine A. Leatherdale, Woodbury, MN (US);

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, Saint Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); B29C 45/16 (2006.01); C08L 83/04 (2006.01); B29C 45/14 (2006.01); B29C 35/08 (2006.01); B29K 83/00 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
B29C 45/1671 (2013.01); C08L 83/04 (2013.01); B29C 45/14655 (2013.01); B29C 2035/0833 (2013.01); B29K 2083/00 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01); C08G 77/80 (2013.01); C08L 2312/06 (2013.01); H01L 33/56 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract

A light emitting device that includes a light emitting diode and a multilayer encapsulant is disclosed. The multilayer encapsulant includes a first encapsulant in contact with the light emitting diode and a photopolymerizable composition in contact with the first encapsulant. The first encapsulant may be a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or another photopolymerizable composition. The photopolymerizable compositions include a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less can be applied to initiate hydrosilylation within the silicon-containing resins.


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