The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Oct. 24, 2012
Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Kouji Yamane, Tokyo, JP;

Tomio Yamakawa, Tokyo, JP;

Kazuhiro Shimoda, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21B 19/04 (2006.01); B21B 23/00 (2006.01); B21B 19/06 (2006.01);
U.S. Cl.
CPC ...
B21B 23/00 (2013.01); B21B 19/04 (2013.01); B21B 19/06 (2013.01);
Abstract

A method of producing a seamless metal pipe, which can suppress the occurrence of lamination defects, is provided. A method of producing a seamless metal pipe according to an embodiment of the present invention includes the steps of: heating a high alloy containing, by mass %, Cr: 20 to 30% and Ni: more than 22% and not more than 60% in a first heating furnace (S2); piercing-rolling the high alloy heated in the first heating furnace with a first piercing machine to produce a hollow shell (S3); heating the hollow shell in a second heating furnace (S4); and elongation-rolling the hollow shell heated in the second heating furnace with the first piercing machine or a second piercing machine which is different from the first piercing machine (S5).


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