The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Mar. 14, 2012
Applicants:

Katsumi Takada, Kawasaki, JP;

Kiyokazu Moriizumi, Kawasaki, JP;

Masayuki Itoh, Kawasaki, JP;

Inventors:

Katsumi Takada, Kawasaki, JP;

Kiyokazu Moriizumi, Kawasaki, JP;

Masayuki Itoh, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H01L 23/36 (2006.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/373 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H05K 1/0212 (2013.01); H05K 3/3494 (2013.01); H05K 13/0486 (2013.01); H01L 23/345 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/83444 (2013.01); H01L 2924/0001 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H05K 3/22 (2013.01); H05K 2201/09263 (2013.01); H05K 2203/1115 (2013.01); H05K 2203/176 (2013.01); Y10T 29/53174 (2015.01);
Abstract

An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.


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