The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Oct. 10, 2011
Applicants:

Hyun Gyu Park, Seoul, KR;

Eun Jin Kim, Seoul, KR;

Hae Yeon Kim, Seoul, KR;

Jae Man Park, Seoul, KR;

Yun Ho an, Seoul, KR;

Hyuk Soo Lee, Seoul, KR;

IN Hee Cho, Seoul, KR;

Inventors:

Hyun Gyu Park, Seoul, KR;

Eun Jin Kim, Seoul, KR;

Hae Yeon Kim, Seoul, KR;

Jae Man Park, Seoul, KR;

Yun Ho An, Seoul, KR;

Hyuk Soo Lee, Seoul, KR;

In Hee Cho, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2015.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01); H05K 3/30 (2006.01); H05K 13/00 (2006.01); G02F 1/1335 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); F21V 29/70 (2015.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); F21V 29/70 (2015.01); G02F 1/133615 (2013.01); H01L 23/3677 (2013.01); H01L 25/0753 (2013.01); H01L 33/647 (2013.01); H05K 1/0204 (2013.01); H05K 3/30 (2013.01); H05K 3/4608 (2013.01); H05K 13/00 (2013.01); H01L 2224/16225 (2013.01); H05K 1/056 (2013.01); H05K 1/113 (2013.01); H05K 2201/09054 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10969 (2013.01); Y10T 29/4913 (2015.01);
Abstract

Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.


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