The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Dec. 17, 2013
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventor:

Kazuhiko Tokuda, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 3/4046 (2013.01); H05K 1/0216 (2013.01); H05K 1/113 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A printed-board includes a first conductor-layer, a second conductor-layer provided to a layer different from the first conductor-layer, an insulation-layer provided between the first conductor-layer and the second conductor-layer, a plurality of through-holes that pass through the first conductor-layer, the second conductor-layer, and the insulation-layer, and a plurality of vias that are formed in the plurality of through-holes, respectively, and couple the first conductor-layer and the second conductor-layer, each of the plurality of vias including a conductor portion that occupies part of an internal space of the through-hole, and a non-conductor portion that occupies remaining part of the internal space, wherein in a given pair of vias adjacent to each other, the conductor portion of one of the pair of vias is arranged so as to face the non-conductor portion of another one of the pair of vias.


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