The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Apr. 26, 2007
Hisao Sakai, Saitama, JP;
Masaru Takahashi, Saitama, JP;
Mitsuyoshi Matsuda, Saitama, JP;
Makoto Dobashi, Saitama, JP;
Hisao Sakai, Saitama, JP;
Masaru Takahashi, Saitama, JP;
Mitsuyoshi Matsuda, Saitama, JP;
Makoto Dobashi, Saitama, JP;
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Abstract
Present invention provides an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. The electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mmto 100 kgf/mmand has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure.