The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Feb. 15, 2013
Applicant:
Sanyo Electric Co., Ltd., Moriguchi-shi, Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/50 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H01M 2/10 (2006.01); H01M 10/653 (2014.01); H01M 10/6554 (2014.01); H01M 10/617 (2014.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01M 2/1077 (2013.01); H01M 2/1094 (2013.01); H01M 10/617 (2015.04); H01M 10/653 (2015.04); H01M 10/6554 (2015.04); H05K 1/053 (2013.01); H05K 1/056 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/0315 (2013.01);
Abstract
A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.