logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9306142 B1

PDFFull Text
Expired
Date of Patent:
Apr. 05, 2016

Filed:

Nov. 23, 2011

High heat-radiant optical device substrate and manufacturing method thereof

Applicants:

Ki Myung Nam, Cheonan-si, KR;

Tae Hwan Song, Cheonan-si, KR;

Young Chul Jun, Ansan-si, KR;

Inventors:

Ki Myung Nam, Cheonan-si, KR;

Tae Hwan Song, Cheonan-si, KR;

Young Chul Jun, Ansan-si, KR;

Assignee:

Point Engineering Co., Ltd., Asan-si, KR;

Attorney:

Sunstein Kann Murphy & Timbers LLP

Primary Examiner:

Philip Tucker

Assistant Examiner:

Brian R Slawski

Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 3/00 (2006.01); B32B 5/00 (2006.01); B32B 5/18 (2006.01); B32B 37/00 (2006.01); H05K 3/46 (2006.01); B32B 38/04 (2006.01); C09J 5/02 (2006.01); B32B 27/00 (2006.01); B32B 7/00 (2006.01); B32B 9/00 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 27/38 (2006.01); H01L 29/18 (2006.01); H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 25/00 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 27/04 (2006.01); B29C 65/48 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 24/97 (2013.01); H01L 33/483 (2013.01); H01L 33/644 (2013.01); H01L 33/647 (2013.01); B29C 65/4835 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/04 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2260/046 (2013.01); H01L 25/50 (2013.01); H01L 33/005 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01); Y10T 428/24612 (2015.01); Y10T 428/31522 (2015.04); Y10T 428/31678 (2015.04);
Abstract

The manufacturing of an optical device substrate is achieved by anodizing the surface of a metal plate, coating an insulative liquid bonding agent, having a viscosity which can permeate into an anodized film of the metal plate, on the metal plate, and alternately layering, pressing, and heat treating the metal plate coated with the liquid bonding agent and an insulative film bonding agent before the liquid bonding agent becomes solid so that bonding force between the metal plate and an insulation layer is strengthened, bubbles formation in the liquid bonding agent is inhibited, the fragile nature of the liquid bonding agent after the solidification is reduced producing an optical device substrate with improved mechanical strength and an insulation layer of precisely controlled thickness.

Find Patent Forward Citations

Nam, Ki. (2016). High heat-radiant optical device substrate and manufacturing method thereof (U.S. Patent No. 9306142). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9306142

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…