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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9306138 B1

PDFFull Text
Date of Patent:
Apr. 05, 2016

Filed:

Jun. 17, 2015

Light emitting diode packaging structure

Applicant:

Xiamen Sanan Optoelectronics Technology Co., Ltd., Xiamen, CN;

Inventors:

Chih-Wei Chao, Xiamen, CN;

Yen-Chih Chiang, Xiamen, CN;

Assignee:

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD., Xiamen, CN;

Attorneys:

Syncoda LLC

Feng Ma

Junjie Feng

Primary Examiner:

William Coleman

Assistant Examiner:

Kien Ly

Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/38 (2010.01); H01L 33/46 (2010.01); H01L 33/20 (2010.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/385 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/20 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01);
Abstract

A packaging structure of a vertical LED chip includes at least a support system, a glue cup that connects to periphery of the support system, a LED chip with light absorption substrate over the support system and packaging glue distributed in periphery of the LED chip, wherein the packaging structure also comprises a baffle that surrounds the outer side wall of the light absorption substrate. Adding of a baffle structure in the support system of the packaging structure can effectively prevent light from being absorbed by the light absorption substrate and reflect such light out of the packaging structure, thus increasing probability of light emitting and improving light intensity of the vertical LED chip.

Find Patent Forward Citations

Chao, Chih-Wei. (2016). Light emitting diode packaging structure (U.S. Patent No. 9306138). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9306138

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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