The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Jul. 29, 2014
Applicant:
Asahi Glass Company, Limited, Chiyoda-ku, JP;
Inventors:
Wataru Kasai, Tokyo, JP;
Yoshiaki Higuchi, Tokyo, JP;
Masakazu Ataku, Tokyo, JP;
Daisuke Taguchi, Tokyo, JP;
Satoshi Otsugu, Tokyo, JP;
Assignee:
Asahi Glass Company, Limited, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); B29C 33/68 (2006.01); B29C 43/18 (2006.01); C08J 5/18 (2006.01); C08F 10/06 (2006.01); H01L 21/56 (2006.01); B29C 43/02 (2006.01); B29C 33/56 (2006.01); H01L 23/00 (2006.01); B29C 37/00 (2006.01); B29C 43/50 (2006.01); C08F 214/26 (2006.01); H01L 33/58 (2010.01); B29C 45/14 (2006.01); B29C 43/34 (2006.01); B29L 11/00 (2006.01); B29K 83/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); B29C 33/56 (2013.01); B29C 33/68 (2013.01); B29C 37/0075 (2013.01); B29C 43/021 (2013.01); B29C 43/18 (2013.01); B29C 43/50 (2013.01); B29C 45/14655 (2013.01); C08F 10/06 (2013.01); C08F 214/265 (2013.01); C08J 5/18 (2013.01); H01L 21/566 (2013.01); H01L 24/97 (2013.01); H01L 33/58 (2013.01); B29C 2043/182 (2013.01); B29C 2043/3444 (2013.01); B29C 2045/14663 (2013.01); B29K 2083/00 (2013.01); B29K 2827/12 (2013.01); B29L 2011/0016 (2013.01); B29L 2031/3406 (2013.01); B29L 2031/3481 (2013.01); C08J 2327/18 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A mold release film, which is adapted to be disposed on the cavity surface of a mold to form a resin-encapsulated portion by encapsulating a semiconductor element of a semiconductor device with a curable encapsulation resin, has a tensile modulus of elasticity of from 10 to 24 MPa at 132° C. as measured in accordance with JIS K 7127, and a peak peel resistance of at most 0.8 N/25 mm.