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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9306020 B1

PDFFull Text
Date of Patent:
Apr. 05, 2016

Filed:

Jun. 28, 2012

Power module and method of manufacturing the power module

Applicants:

Shinichi Fujino, Hitachinaka, JP;

Hideto Yoshinari, Hitachinaka, JP;

Shiro Yamashita, Tokyo, JP;

Inventors:

Shinichi Fujino, Hitachinaka, JP;

Hideto Yoshinari, Hitachinaka, JP;

Shiro Yamashita, Tokyo, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Kyoung Lee

Assistant Examiner:

Joannie A Garcia

Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/45 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/482 (2006.01); H01L 29/417 (2006.01); H01L 23/488 (2006.01); H01L 23/492 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 29/45 (2013.01); H01L 23/36 (2013.01); H01L 23/4334 (2013.01); H01L 23/488 (2013.01); H01L 23/4824 (2013.01); H01L 23/492 (2013.01); H01L 23/49524 (2013.01); H01L 23/49531 (2013.01); H01L 23/49575 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 25/18 (2013.01); H01L 29/41708 (2013.01); H01L 23/473 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A power module includes a semiconductor device having at least one electrode surface on each side thereof, a first conductive member connected to the electrode surface provided on one side of the semiconductor device with solder, and a second conductive member connected to the electrode surface provided on the other side of the semiconductor device with solder, with at least one of the electrode surfaces provided on the one side of the semiconductor device being double comb-shaped.

Find Patent Forward Citations

Fujino, Shinichi. (2016). Power module and method of manufacturing the power module (U.S. Patent No. 9306020). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9306020

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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