The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Mar. 10, 2014
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1343 (2006.01); G02F 1/1345 (2006.01); H01L 27/32 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3276 (2013.01); H01L 23/4985 (2013.01); G02F 1/13452 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/12044 (2013.01);
Abstract
Provided are a chip-on-film (COF) package and a device assembly including the same. The device assembly includes a COF package including a film substrate on which a plurality of film-through wires are formed. The device assembly includes a panel unit including a panel substrate on which a plurality of panel-through wires are formed. The panel unit is disposed on the COF package. One end of the panel unit is electrically connected to a first end of the COF package. The device assembly includes a control unit disposed below the panel unit. One end of the control unit is electrically connected to a second end of the COF package.