The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Jan. 15, 2015
Sony Corporation, Tokyo, JP;
Hiroki Hagiwara, Kanagawa, JP;
Keiji Sasano, Tokyo, JP;
Hiroaki Tanaka, Kanagawa, JP;
Yuki Tuji, Kanagawa, JP;
Tsuyoshi Watanabe, Kanagawa, JP;
Koji Tsuchiya, Kanagawa, JP;
Kenzo Tanaka, Kagoshima, JP;
Takaya Wada, Miyazaki, JP;
Noboru Kawabata, Kagoshima, JP;
Hirokazu Yoshida, Kagoshima, JP;
Hironori Yokoyama, Kumamoto, JP;
SONY CORPORATION, Tokyo, JP;
Abstract
A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.