The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Aug. 26, 2014
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Victor Lenchenkov, Sunnyvale, CA (US);

Xianmin Yi, Menlo Park, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/0216 (2014.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14623 (2013.01); H01L 27/1462 (2013.01); H01L 27/14629 (2013.01); H01L 31/02164 (2013.01); H01L 31/02168 (2013.01); H04N 5/369 (2013.01); H01L 27/1463 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 31/02162 (2013.01);
Abstract

An image sensor with an array of image sensor pixels is provided. Each pixel may include a photodiode and associated pixel circuits formed in a semiconductor substrate. Buried light shields may be formed on the substrate to present pixel circuitry that is formed in the substrate between two adjacent photodiodes from being exposed to incoming light. Metal interconnect muting structures may be formed over the buried light shields. In one embodiment, light blocking structures may be formed to completely seal the interconnect routing structures. The light blocking structures may be formed on top of the buried light shields or on the surface of the substrate. In another embodiment, planar light blocking structures that are parallel to the surface of the substrate may be formed between metal routing layers to help absorb stray light. Light blocking structures formed in these ways can help reduce optical crosstalk and enhance global shutter efficiency.


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