The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

May. 07, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Masafumi Horio, Matsumoto, JP;

Kyohei Fukuda, Matsumoto, JP;

Motohito Hori, Matsumoto, JP;

Yoshinari Ikeda, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 25/18 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 24/01 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/074 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4912 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A semiconductor device includes an insulating substrate having a first conductive pattern on a first insulating substrate; a first semiconductor element having one surface fixed to the first conductive pattern; a printed circuit board having a conductive layer on a second insulating substrate and a plurality of metal pins fixed to the conductive layer; and a third insulating substrate. A portion of pins constituting the metal pins is fixed to other surface of the first semiconductor element, and the printed circuit board with the metal pins is sandwiched between the insulating substrate having the first conductive pattern and the third insulating substrate.


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