The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2016
Filed:
Feb. 28, 2014
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventor:
Masaji Iwamoto, Kanagawa-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/0652 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor device includes a substrate, a controller chip, and memory chips. Wiring is formed on the substrate. The controller chip has a rectangular surface area, and is mounted on the substrate. The memory chips have quadrangular surface areas, and are superposed on the substrate on a first major side of the controller chip. The first major side defines a first direction and a first controller terminal block is formed along a first minor side thereof orthogonal to the first direction, and a second controller terminal block is formed along a second major side opposite to the first major side.