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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9305892 B1

PDFFull Text
Date of Patent:
Apr. 05, 2016

Filed:

May. 01, 2014

Adhesive for electronic component

Applicants:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Henkel Japan Limited, Tokyo, JP;

Inventors:

Sugiura Yoko, Yokohama, JP;

Horiguchi Yusuke, Yokohama, JP;

Mieko Sano, Yokohama, JP;

Gina Hoang, Garden Grove, CA (US);

Assignees:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

Attorney:

Steven C. Bauman

Primary Examiner:

Richard Booth

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); C09J 133/06 (2006.01); C09J 133/08 (2006.01); C09J 201/02 (2006.01); C09J 4/06 (2006.01); H01L 21/78 (2006.01); H05K 1/03 (2006.01); C09J 151/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 4/06 (2013.01); C09J 133/06 (2013.01); C09J 133/08 (2013.01); C09J 151/003 (2013.01); C09J 201/02 (2013.01); H01L 21/78 (2013.01); H01L 24/83 (2013.01); H05K 1/0373 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/12042 (2013.01); Y10T 428/2848 (2015.01); Y10T 428/2852 (2015.01);
Abstract

An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

Find Patent Forward Citations

Yoko, Sugiura. (2016). Adhesive for electronic component (U.S. Patent No. 9305892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9305892

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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