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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9305829 B1

PDFFull Text
Expired
Date of Patent:
Apr. 05, 2016

Filed:

Sep. 30, 2014

Semiconductor package with an indented portion and manufacturing method thereof

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon, KR;

Inventors:

Jun Woo Myung, Suwon, KR;

Sung Min Song, Suwon, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon, KR;

Attorney:
Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 23/12 (2006.01); H01L 23/34 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/13 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76802 (2013.01); H01L 21/565 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); H01L 23/4334 (2013.01); H01L 23/49531 (2013.01); H01L 23/49575 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor package includes a substrate, at least one electronic device, a lead frame, and a molded portion. The substrate has at least one indented portion formed as a groove therein. The electronic device is mounted on one surface of the substrate. The lead frame is bonded to the substrate and electrically connected to the electronic device. The molded portion seals the lead frame and the electronic device and includes at least one through hole extending the indented portion.

Find Patent Forward Citations

Myung, Jun. (2016). Semiconductor package with an indented portion and manufacturing method thereof (U.S. Patent No. 9305829). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9305829

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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