The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

May. 30, 2014
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Hsing-Kai Cheng, Hsinchu, TW;

Yu-Jen Lin, Hsinchu, TW;

Yen-Ting Lin, Hsinchu, TW;

Ta-Wen Lo, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/13 (2006.01); G01R 1/20 (2006.01); H01C 1/148 (2006.01); H01C 7/00 (2006.01);
U.S. Cl.
CPC ...
H01C 7/13 (2013.01); G01R 1/203 (2013.01); H01C 1/148 (2013.01); H01C 7/003 (2013.01);
Abstract

A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.


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