The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Jul. 21, 2011
Applicants:

Aya Miki, Kobe, JP;

Toshihiro Kugimiya, Kobe, JP;

Yasuaki Terao, Kobe, JP;

Inventors:

Aya Miki, Kobe, JP;

Toshihiro Kugimiya, Kobe, JP;

Yasuaki Terao, Kobe, JP;

Assignee:

Kobe Steel, Ltd., Kobe-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 17/06 (2006.01); B32B 15/04 (2006.01); G09F 9/30 (2006.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/04 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01L 21/285 (2006.01); H01L 21/3205 (2006.01); H01L 23/532 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); G02F 1/1362 (2006.01); C23C 28/00 (2006.01); H01L 27/12 (2006.01); C23C 14/18 (2006.01); H01L 27/32 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
G09F 9/30 (2013.01); C22C 9/00 (2013.01); C22C 9/01 (2013.01); C22C 9/04 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22F 1/08 (2013.01); C23C 14/185 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 28/345 (2013.01); G02F 1/136286 (2013.01); H01L 21/2855 (2013.01); H01L 21/32051 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 27/124 (2013.01); H01L 27/1255 (2013.01); H01L 29/45 (2013.01); H01L 29/458 (2013.01); H01L 29/4908 (2013.01); H01L 29/78669 (2013.01); G02F 2001/136295 (2013.01); H01L 27/3279 (2013.01); H01L 29/7869 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/12535 (2015.01); Y10T 428/12611 (2015.01);
Abstract

The present invention provides a display device which is provided with a Cu alloy film having high adhesion to an oxygen-containing insulator layer and a low electrical resistivity. The present invention relates to a Cu alloy film for a display device, said film having a stacked structure including a first layer (Y) composed of a Cu alloy containing, in total, 1.2-20 atm % of at least one element selected from among a group composed of Zn, Ni, Ti, Al, Mg, Ca, W, Nb and Mn, and a second layer (X) composed of pure Cu or a Cu alloy having Cu as a main component and an electrical resistivity lower than that of the first layer (Y). A part of or the whole first layer (Y) is directly in contact with an oxygen-containing insulator layer (), and in the case where the first layer (Y) contains Zn or Ni, the thickness of the first layer (Y) is 10-100 nm, and in the case where the first layer (Y) does not contain Zn and Ni, the thickness of the first layer (Y) is 12-100 nm. The present invention also relates to a display device having the Cu alloy film.


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