The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Sep. 29, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

David M. Rockford, Los Alamitos, CA (US);

William F. Leggett, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1658 (2013.01); C09J 7/0232 (2013.01); G06F 1/1616 (2013.01); C09J 7/0225 (2013.01); C09J 7/0246 (2013.01); C09J 7/0264 (2013.01); C09J 2201/128 (2013.01); C09J 2201/20 (2013.01); C09J 2201/606 (2013.01); C09J 2205/302 (2013.01); Y10T 428/14 (2015.01); Y10T 428/1476 (2015.01); Y10T 428/24802 (2015.01); Y10T 428/28 (2015.01);
Abstract

This application relates to methods and apparatus relating to an adhesive bond that includes an integrated release mechanism. The adhesive bond can secure components in a portable electronic device, such as a battery, to the housing of the portable electronic device. The release mechanism can be embodied as a thin layer of polymeric material sandwiched between a first adhesive layer and a second adhesive layer. The first and second adhesive layers are joined to one another by a number of pillars that extend through openings in the release mechanism. A portion of the release mechanism can protrude from the adhesive bond allowing a technician or user to pull the release mechanism out of the adhesive bond, which severs the pillars that hold the adhesive layers together. In this way, the release mechanism allows for efficient separation of the adhesively secured components.


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