The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Jan. 17, 2014
Applicants:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa, JP;

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Takayoshi Moriyama, Miura, JP;

Kazunari Higuchi, Yokosuka, JP;

Sumio Hashimoto, Yokosuka, JP;

Shinichi Kumashiro, Yokosuka, JP;

Assignees:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa-ken, JP;

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); F21V 29/00 (2015.01); F21S 8/02 (2006.01); F21V 19/00 (2006.01); F21V 21/00 (2006.01); F21V 17/12 (2006.01); F21Y 101/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
F21V 29/00 (2013.01); F21S 8/026 (2013.01); F21V 19/0055 (2013.01); F21V 21/00 (2013.01); F21V 29/004 (2013.01); H05K 1/0271 (2013.01); F21V 17/12 (2013.01); F21V 19/0035 (2013.01); F21Y 2101/02 (2013.01); H05K 1/0206 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10598 (2013.01);
Abstract

A lighting apparatus including at least one light-emitting element mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer.


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