The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Jun. 07, 2013
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Guruprasad Sundararajan, Bangalore, IN;

Marko Klaus Baller, Riegelsberg, DE;

Swarnagowri Addepalli, Bangalore, IN;

Satyanarayanan Seshadri, Bangalore, IN;

Dinesh R. Rakwal, Bangalore, IN;

Subhashish Dasgupta, Bangalore, IN;

Heikki Haveri, Helsinki, FI;

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23H 3/00 (2006.01); B23H 9/14 (2006.01); C25F 3/06 (2006.01); B23H 9/00 (2006.01); B23H 3/08 (2006.01);
U.S. Cl.
CPC ...
C25F 3/06 (2013.01); B23H 3/00 (2013.01); B23H 9/00 (2013.01); B23H 9/14 (2013.01); B23H 3/08 (2013.01);
Abstract

The present disclosure relates to methods for manufacturing porous mesh plates for use in ultrasonic mesh nebulizers, and the porous mesh plates manufactured by those methods. Cone-shaped dimples are first drilled in a substrate (e.g. a plate), but do not penetrate the bottom of the substrate. Next, the substrate (e.g. a plate) is subject to an electrochemical process to remove a layer of material from the surface of the substrate. Enough material is removed to allow the dimples to penetrate the substrate, thereby creating holes in the substrate. The size of the holes can be controlled by the conditions of the electrochemical process.


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