The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

Oct. 02, 2014
Applicants:

Chih-ming Sun, Hsin-Chu, TW;

Ming-han Tsai, Hsin-Chu, TW;

Hsin-hui Hsu, Hsin-Chu, TW;

Weichung Wang, Hsin-Chu, TW;

Inventors:

Chih-Ming Sun, Hsin-Chu, TW;

Ming-Han Tsai, Hsin-Chu, TW;

Hsin-Hui Hsu, Hsin-Chu, TW;

WeiChung Wang, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/007 (2013.01); B81B 3/0013 (2013.01); B81B 2203/0118 (2013.01);
Abstract

The invention provides a MEMS device with enhanced structural strength. The MEMS device includes a plurality of metal layers, including a top metal layer with a plurality of metal segments. The metal segments are individually connected to an adjacent metal layer immediately under the top metal layer through at least one supporting pillar, and there is no dielectric layer between the metal segments and the adjacent metal layer immediately under the top metal layer. The metal layers except the top metal layer are respectively connected to their adjacent metal layers through at least one supporting pillar and a dielectric layer filling in between.


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