The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2016

Filed:

May. 21, 2013
Applicant:

Seiko Instruments Inc., Chiba, JP;

Inventors:

Norimitsu Sanbongi, Chiba, JP;

Keitaro Koroishi, Chiba, JP;

Toshimitsu Morooka, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/15 (2006.01); B41J 2/335 (2006.01); H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/33515 (2013.01); B41J 2/3357 (2013.01); B41J 2/3358 (2013.01); B41J 2/3359 (2013.01); B41J 2/33585 (2013.01); H01C 17/00 (2013.01); Y10T 29/49083 (2015.01);
Abstract

A thermal head has a support substrate, an upper substrate arranged on the support substrate on one surface side thereof in a laminated state, and an intermediate layer arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other. The intermediate layer has one of a through hole and a concave portion forming a cavity portion between the upper substrate and the support substrate. A heat generating resistor is formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion. The intermediate layer is formed of a glass paste having a melting point lower than a firing temperature of the support substrate and higher than a melting temperature of the upper substrate.


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