The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jul. 25, 2012
Applicants:

Morio Kuwano, Hitachinaka, JP;

Yosei Hara, Hitachinaka, JP;

Haruki Hamada, Hitachinaka, JP;

Inventors:

Morio Kuwano, Hitachinaka, JP;

Yosei Hara, Hitachinaka, JP;

Haruki Hamada, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); B60L 11/14 (2006.01); H05K 7/14 (2006.01); B60L 3/00 (2006.01); B60L 11/00 (2006.01); B60L 15/00 (2006.01); B60L 15/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); B60L 3/003 (2013.01); B60L 3/0061 (2013.01); B60L 11/005 (2013.01); B60L 11/14 (2013.01); B60L 15/007 (2013.01); B60L 15/2009 (2013.01); H02M 7/003 (2013.01); H05K 7/1432 (2013.01); H05K 7/2089 (2013.01); H05K 7/20218 (2013.01); H05K 7/20927 (2013.01); H05K 7/20945 (2013.01); B60L 2210/40 (2013.01); B60L 2220/14 (2013.01); B60L 2240/36 (2013.01); B60L 2240/423 (2013.01); B60L 2240/443 (2013.01); B60L 2240/525 (2013.01); B60L 2270/145 (2013.01); Y02T 10/642 (2013.01); Y02T 10/70 (2013.01); Y02T 10/7022 (2013.01); Y02T 10/7077 (2013.01); Y02T 10/7241 (2013.01); Y02T 10/7275 (2013.01);
Abstract

Provided is a power conversion apparatus that includes a power semiconductor module, a smoothing capacitor module, an alternating-current bus bar, a control circuit unit to control the power semiconductor element, and a flow channel formation body to form a flow channel through which a cooling medium flows. The power semiconductor module has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion. A flow channel formation body external portion of the flow channel formation body has a first surface wall that faces the first heat dissipation portion with the flow channel therebetween, a second surface wall that faces the second heat dissipation portion with the flow channel therebetween, and a sidewall to connect the first surface wall and the second surface wall. The sidewall has an opening to insert the power semiconductor module into the flow channel.


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