The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jun. 26, 2014
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Masashi Miyazaki, Tokyo, JP;

Yuichi Sugiyama, Tokyo, JP;

Tatsuro Sawatari, Tokyo, JP;

Hideki Yokota, Tokyo, JP;

Yutaka Hata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 3/46 (2006.01); H05K 3/44 (2006.01); B05D 3/12 (2006.01); H05K 3/00 (2006.01); H05K 3/04 (2006.01); H05K 3/30 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H05K 3/4647 (2013.01); B05D 3/12 (2013.01); B05D 5/12 (2013.01); H05K 1/185 (2013.01); H05K 3/007 (2013.01); H05K 3/0044 (2013.01); H05K 3/0094 (2013.01); H05K 3/04 (2013.01); H05K 3/06 (2013.01); H05K 3/30 (2013.01); H05K 3/42 (2013.01); H05K 3/445 (2013.01); H05K 3/4608 (2013.01); H05K 2201/10204 (2013.01);
Abstract

The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.


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