The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Dec. 18, 2013
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya, Aichi, JP;

Inventors:

Yuma Otsuka, Komaki, JP;

Kazunori Fukunaga, Inuyama, JP;

Atsushi Uchida, Kakamigahara, JP;

Kouhei Yoshimura, Nagoya, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01); H05K 3/40 (2006.01); C23C 28/02 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); H05K 1/0306 (2013.01); H05K 1/18 (2013.01); H05K 3/246 (2013.01); H05K 3/429 (2013.01); H05K 3/4629 (2013.01);
Abstract

A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper layer and a coating metal layer covering a surface of the copper layer. The ceramic substrate includes a contact layer disposed between the ceramic substrate main body and the copper layer. The contact layer includes one of a nickel-chromium alloy, chromium, molybdenum, and palladium, and is set back from a side surface of the copper layer in a substrate plane direction.


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