The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Mar. 29, 2010
Applicants:
Naoto Takahashi, Shunan, JP;
Yuichiro Minabe, Shunan, JP;
Inventors:
Naoto Takahashi, Shunan, JP;
Yuichiro Minabe, Shunan, JP;
Assignee:
TOKUYAMA CORPORATION, Shunan-shi, Yamaguchi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C23C 18/06 (2006.01); C23C 18/08 (2006.01); C04B 41/52 (2006.01); H01L 23/498 (2006.01); C04B 41/00 (2006.01); C04B 41/90 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); C04B 41/009 (2013.01); C04B 41/52 (2013.01); C04B 41/90 (2013.01); C23C 18/06 (2013.01); C23C 18/08 (2013.01); H01L 23/498 (2013.01); H01L 23/49883 (2013.01); C04B 2111/00844 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24612 (2015.01);
Abstract
The present invention provides a process for producing a metalized substrate in which a predetermined metal paste composition is applied onto a sintered nitride ceramic substrate (); the resultant is fired in a heat-resistant container at a predetermined condition; and the substrate () and a metal layer () are bonded together to each other through a titanium nitride layer ().