The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Dec. 18, 2013
Applicant:
Jds Uniphase Corporation, Milpitas, CA (US);
Inventors:
Kong Weng Lee, San Jose, CA (US);
Vincent V. Wong, Los Altos, CA (US);
Assignee:
Lumentum Operations LLC, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/024 (2006.01); H01S 5/00 (2006.01); H01S 5/022 (2006.01); H01S 5/026 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01S 3/04 (2013.01); H01S 3/0405 (2013.01); H01S 5/0071 (2013.01); H01S 5/024 (2013.01); H01S 5/026 (2013.01); H01S 5/0228 (2013.01); H01S 5/0261 (2013.01); H01S 5/02244 (2013.01); H01S 5/02272 (2013.01); H01S 5/02276 (2013.01); H01S 5/02407 (2013.01); H01S 5/0262 (2013.01);
Abstract
A leadframe-type packaged laser diode is provided, in which the laser diode chip is electrically decoupled from the package. A leadframe-type package including a two-dimensional grid of electrodes encapsulated in a molded plastic framework allows batch processing of one- or two-dimensional arrays of leadframes, the batch processing including laser diode chips attachment, wirebonding, and packaging, with subsequent breakout of individual packaged laser diodes from the one- or two-dimensional array.