The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Jul. 12, 2013
Applicant:

Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;

Inventors:

Masahiro Yoshida, Osaka, JP;

Takehiko Kawamura, Osaka, JP;

Katsuhiro Okada, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); G02F 1/1362 (2006.01); G09G 3/00 (2006.01); G09G 3/36 (2006.01); H01L 21/66 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0041 (2013.01); G02F 1/1362 (2013.01); G09G 3/006 (2013.01); G09G 3/3611 (2013.01); H01L 22/14 (2013.01); G02F 2001/13456 (2013.01); G02F 2001/136254 (2013.01); G09G 3/3648 (2013.01); G09G 2300/0426 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An active matrix substrate () is provided with first connecting wirings () connected to gate terminals () to which extraction wirings () are connected, second connecting wirings () connected to gate terminals () to which extraction wirings () are connected, bundled wirings (to) each composed of a mutually adjacent first connecting wiring and second connecting wiring bundled together, a first inspection wiring () capable of inputting an inspection signal to bundled wirings () that are not adjacent to each other among the bundled wirings, and a second inspection wiring () capable of inputting an inspection signal to bundled wirings () that are not adjacent to each other and not connected to the first inspection wiring () among the bundled wirings.


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