The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

May. 30, 2014
Applicant:

Japan Display Inc., Tokyo, JP;

Inventors:

Kouhei Takahashi, Tokyo, JP;

Toshihiro Sato, Tokyo, JP;

Naohisa Ando, Tokyo, JP;

Hiroshi Kawanago, Tokyo, JP;

Assignee:

JAPAN DISPLAY INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3276 (2013.01); H05K 1/189 (2013.01); H05K 3/323 (2013.01); H01L 2227/323 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A circuit unit is provided in which it is possible to connect circuit board to a terminal using a simple operation without removing a passivation film from above the terminal. A metal electrode which conducts with a circuit element is formed above a substrate. Multiple column shaped insulation films are each formed at a uniform pitch in two intersecting directions above the surface of the metal electrode. A metal electrode is formed above the metal electrode including the insulation film. A passivation film is formed on a surface of the metal electrode. Conductive beads are stuck between pairs of projection structured bodies formed on a surface of the passivation film, the passivation film on a side surface of the projection structure is scraped whereby the conductive beads conduct simultaneously with the metal electrode and an electrode formed on the circuit board.


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