The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Nov. 18, 2011
Applicants:

Yashodhan Vijay Moghe, Marsfield, AU;

Andrew Terry, Picton, AU;

Andrew James Read, West Pennant Hills, AU;

Steven Grant Duvall, Manly, AU;

Inventors:

Yashodhan Vijay Moghe, Marsfield, AU;

Andrew Terry, Picton, AU;

Andrew James Read, West Pennant Hills, AU;

Steven Grant Duvall, Manly, AU;

Assignee:

THE SILANNA GROUP PTY LTD, Eight Mile Plains, Queensland, AU;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/522 (2006.01); H01L 23/60 (2006.01); H01L 27/06 (2006.01); H01L 23/48 (2006.01); H01L 27/02 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5222 (2013.01); H01L 23/48 (2013.01); H01L 23/5223 (2013.01); H01L 23/60 (2013.01); H01L 27/0207 (2013.01); H01L 27/0248 (2013.01); H01L 27/0255 (2013.01); H01L 27/0629 (2013.01); H01L 28/40 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01);
Abstract

An integrated circuit, including at least two integrated circuit portions mutually spaced on a single electrically insulating die and at least one coupling region on the die to provide capacitive coupling between the otherwise mutually isolated integrated circuit portions, the integrated circuit portions being formed by a plurality of layers on the single die, the layers including metal and dielectric layers and at least one semiconductor layer; wherein at least one of the dielectric layers extends from the integrated circuit portions across the coupling region and at least a corresponding one of the metal layers and/or at least one semiconductor layer extends from each of the integrated circuit portions and partially across the coupling region to form capacitors therein and thereby provide the capacitive coupling between the integrated circuit portions.


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