logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9299654 B1

PDFFull Text
Expired
Date of Patent:
Mar. 29, 2016

Filed:

Dec. 13, 2012

Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device

Applicants:

Kyoung Hun Shin, Uiwang-si, KR;

DO Hyun Park, Uiwang-si, KR;

Hyun Joo Seo, Uiwang-si, KR;

Young Ju Shin, Uiwang-si, KR;

Kang Bae Yoon, Uiwang-si, KR;

Inventors:

Kyoung Hun Shin, Uiwang-si, KR;

Do Hyun Park, Uiwang-si, KR;

Hyun Joo Seo, Uiwang-si, KR;

Young Ju Shin, Uiwang-si, KR;

Kang Bae Yoon, Uiwang-si, KR;

Assignee:

CHEIL INDUSTRIES, INC., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Evan Pert

Assistant Examiner:

Shaka White

Int. Cl.
CPC ...
H01B 1/06 (2006.01); H01B 1/24 (2006.01); H01B 1/02 (2006.01); H01B 1/22 (2006.01); H01L 23/498 (2006.01); H01B 1/20 (2006.01); H01L 23/00 (2006.01); C09J 7/02 (2006.01); C09J 9/00 (2006.01); C09J 11/08 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49883 (2013.01); C09J 7/02 (2013.01); C09J 9/00 (2013.01); C09J 11/08 (2013.01); H01B 1/20 (2013.01); H01L 24/29 (2013.01); C08K 5/00 (2013.01); C08K 2201/001 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2423/04 (2013.01); C09J 2475/00 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/07811 (2013.01);
Abstract

A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.

Find Patent Forward Citations

Shin, Kyoung. (2016). Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device (U.S. Patent No. 9299654). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9299654

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…