The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

May. 09, 2011
Applicants:

Minoru Satoh, Chuo-ku, JP;

Takehiro Yamashita, Miyoshi, JP;

Atsushi Nagai, Miyoshi, JP;

Yasuo Adachi, Miyoshi, JP;

Inventors:

Minoru Satoh, Chuo-ku, JP;

Takehiro Yamashita, Miyoshi, JP;

Atsushi Nagai, Miyoshi, JP;

Yasuo Adachi, Miyoshi, JP;

Assignees:

TDK CORPORATION, Tokyo, JP;

NORITAKE CO., LTD., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/04 (2006.01); H01B 1/02 (2006.01); H01L 23/498 (2006.01); H01B 1/16 (2006.01); H01L 23/00 (2006.01); H01K 13/04 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49883 (2013.01); H01B 1/16 (2013.01); H01L 24/48 (2013.01); H01L 23/15 (2013.01); H01L 24/45 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/15787 (2013.01);
Abstract

This electronic component is provided with an inorganic substrate, a conductor film formed on a surface of the substrate, and bonding wires bonded to a part of said conductor film, and wire bonding sections are formed on at least a part of the electronic component. The part of the conductor film at least forming the aforementioned wire bonding sections contains an Ag-based metal formed of Ag or an alloy having Ag as the main constituent and a metal oxide which coats said Ag-based metal and which has, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating quantity of the metal oxide is a quantity corresponding to 0.02 to 0.1 parts by mass relative to 100 parts by mass of the aforementioned Ag-based metal.


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