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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9299652 B1

PDFFull Text
Date of Patent:
Mar. 29, 2016

Filed:

Aug. 20, 2013

Device and method of manufacturing the same

Applicant:

Ps5 Luxco S.a.r.l., Luxembourg, LU;

Inventor:

Osamu Kindo, Tokyo, JP;

Assignee:

PS5 LUXCO S.A.R.L., Luxembourg, LU;

Attorney:

Kunzler Law Group

Primary Examiner:

Jasmine Clark

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); B29C 45/26 (2006.01); B29C 45/34 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); B29C 45/14655 (2013.01); B29C 45/2669 (2013.01); B29C 45/34 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3142 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); B29C 45/14311 (2013.01); B29C 2045/14327 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18301 (2013.01);
Abstract

A device includes a substrate having a base member and an insulation film formed on a surface of the base member, a first semiconductor chip mounted over a surface of the substrate on which the insulation film are formed, a second semiconductor chip stacked over the first semiconductor chip so that an overhang portion is formed, and a sealing member formed on the substrate so that the first semiconductor chip and the second semiconductor chip are covered with the sealing member. The insulation film has a first opening portion in a first area of the substrate that overlaps the overhang portion. The base member has an air passage communicating with the first opening portion.

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