The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Aug. 23, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Shailesh Kumar, Noida, IN;

Piyush Kumar Mishra, Noida, IN;

Assignee:

FREESCALE SEMICONDUCTOR,INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 2224/48247 (2013.01);
Abstract

A semiconductor device includes a die having first contact pads and a second contact pad. Signal leads, each having embedded portion and an exposed portion, are electrically connected to respective ones of the first contact pads. A power bar extends in an area between the signal lead embedded portions and the die and has a first side opposing the signal leads and a second side opposing the die. The power bar is electrically connected to the second contact pad. An electrically grounded ground bar extends at least partially in the area. The ground bar has a first portion between the signal lead embedded portions and the first side of the power bar, and a second portion between the second side of the power bar and the die.


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