The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Sep. 29, 2008
Zheng Wang, Mountain View, CA (US);
Connie Wang, Mountain View, CA (US);
Erik Wilson, Santa Clara, CA (US);
Wen Yu, Pleasanton, CA (US);
Robert Chiu, San Jose, CA (US);
Zheng Wang, Mountain View, CA (US);
Connie Wang, Mountain View, CA (US);
Erik Wilson, Santa Clara, CA (US);
Wen Yu, Pleasanton, CA (US);
Robert Chiu, San Jose, CA (US);
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.