The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Oct. 01, 2010
Applicants:
Hoshiaki Terao, Niigata, JP;
Hidoaki Kobiki, Tokyo, JP;
Inventors:
Hoshiaki Terao, Niigata, JP;
Hidoaki Kobiki, Tokyo, JP;
Assignee:
JFE Precision Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H01L 23/373 (2006.01); B22F 3/26 (2006.01); C22C 9/00 (2006.01); C22C 27/06 (2006.01); C22C 30/02 (2006.01); C22F 1/08 (2006.01); C22F 1/18 (2006.01); C22C 1/04 (2006.01); C22F 1/11 (2006.01); H01L 23/473 (2006.01); B22F 7/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B22F 3/26 (2013.01); B22F 7/04 (2013.01); B32B 15/01 (2013.01); C22C 1/045 (2013.01); C22C 1/0425 (2013.01); C22C 9/00 (2013.01); C22C 27/06 (2013.01); C22C 30/02 (2013.01); C22F 1/08 (2013.01); C22F 1/11 (2013.01); C22F 1/18 (2013.01); H01L 23/3736 (2013.01); B22F 2007/045 (2013.01); H01L 23/473 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer.
Terao, Hoshiaki. (2016). Heat sink for electronic device and process for production thereof (U.S. Patent No. 9299636). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9299636
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile