The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
May. 23, 2014
Ae-nee Jang, Seoul, KR;
Young-lyong Kim, Daejeon, KR;
Ae-Nee Jang, Seoul, KR;
Young-Lyong Kim, Daejeon, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
According to example embodiments, a stack-type semiconductor package includes a lower semiconductor package, an upper semiconductor package, connection pads, and a metal layer pattern. The lower semiconductor package includes a lower semiconductor chip on a top surface of a lower package substrate, lower lands on the lower package substrate, and an encapsulant on the top surface of the lower package substrate. The encapsulant defines via holes that expose the lower lands. The upper semiconductor package is on the encapsulant. Upper solder balls are connected to a bottom surface of the upper semiconductor package. The connection pads are on the via holes and the encapsulant. The connection pads electrically connect the lower semiconductor package to the upper semiconductor package. The metal layer pattern is between the lower package substrate and the upper semiconductor package. The metal layer pattern surrounds the connection pads and is isolated from the connection pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile