The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Oct. 07, 2013
Oracle International Corporation, Redwood City, CA (US);
Hiren D. Thacker, San Diego, CA (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
Robert David Hopkins, II, Foster City, CA (US);
Jon Lexau, Beaverton, OR (US);
Xuezhe Zheng, San Diego, CA (US);
Ronald Ho, Mountain View, CA (US);
Ivan Shubin, San Diego, CA (US);
John E. Cunningham, San Diego, CA (US);
ORACLE INTERNATIONAL CORPORATION, Redwood Shores, CA (US);
Abstract
A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.