The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Mar. 19, 2014
Applicants:
Wai Yew Lo, Petaling Jaya, MY;
Lan Chu Tan, Singapore, SG;
Inventors:
Wai Yew Lo, Petaling Jaya, MY;
Lan Chu Tan, Singapore, SG;
Assignee:
FREESCALE SEMICONDUCTOR,INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); G01L 9/00 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
G01L 9/00 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/165 (2013.01); H01L 21/561 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/1624 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48157 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/143 (2013.01); H01L 2924/146 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need to used bonds to electrically connect the pressure-sensing die to the MCU, thereby saving time, reducing size, and reducing cost.