The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
May. 17, 2010
Applicants:
Takahisa Sueoka, Osaka, JP;
Hirohiko Matsushita, Osaka, JP;
Shuuji Ikegami, Osaka, JP;
Lan Jiang, Osaka, JP;
Inventors:
Takahisa Sueoka, Osaka, JP;
Hirohiko Matsushita, Osaka, JP;
Shuuji Ikegami, Osaka, JP;
Lan Jiang, Osaka, JP;
Assignee:
DAIKIN INDUSTRIES, LTD., Osaka-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); F28D 1/047 (2006.01); F28F 13/18 (2006.01); B01D 53/26 (2006.01); B01D 53/28 (2006.01); B01J 20/26 (2006.01); B01J 20/28 (2006.01); B01J 20/30 (2006.01); B01J 20/32 (2006.01); F24F 3/14 (2006.01); F28F 1/32 (2006.01);
U.S. Cl.
CPC ...
F28D 1/0477 (2013.01); B01D 53/261 (2013.01); B01D 53/28 (2013.01); B01J 20/26 (2013.01); B01J 20/28004 (2013.01); B01J 20/3042 (2013.01); B01J 20/3214 (2013.01); B01J 20/3268 (2013.01); B23P 15/26 (2013.01); F24F 3/1411 (2013.01); F24F 3/1429 (2013.01); F28F 1/32 (2013.01); F28F 13/18 (2013.01); B01D 2253/202 (2013.01); F28F 2245/02 (2013.01); Y10T 29/4935 (2015.01);
Abstract
In an adsorption heat exchanger, adsorbent expanded by absorbing moisture and contracted by dissipating moisture is supported on a surface of a heat exchanger body. An adsorbent layer containing the adsorbent is formed on the surface of the heat exchanger body by applying slurry containing the adsorbent in a contracted state to the surface of the heat exchanger body and drying the slurry. A solvent of the slurry contains alcohol as a main component.