The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9296928 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 29, 2016

Filed:

Jul. 28, 2011
Applicant:

Yun Kil Shin, Sherman Oaks, CA (US);

Inventor:

Yun Kil Shin, Sherman Oaks, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/02 (2006.01); C09J 161/06 (2006.01); C09J 163/00 (2006.01); C09J 179/04 (2006.01); C09J 179/08 (2006.01); C08G 59/18 (2006.01); B32B 7/12 (2006.01); C09D 133/02 (2006.01);
U.S. Cl.
CPC ...
C09J 133/02 (2013.01); B32B 7/12 (2013.01); C08G 59/186 (2013.01); C09D 133/02 (2013.01); C09J 161/06 (2013.01); C09J 163/00 (2013.01); C09J 179/04 (2013.01); C09J 179/085 (2013.01); Y10T 428/2982 (2015.01); Y10T 428/31515 (2015.04);
Abstract

A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.


Find Patent Forward Citations

Shin, Yun. (2016). Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive (U.S. Patent No. 9296928). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9296928

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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