The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Sep. 03, 2014
Applicant:

Zzyzx Polymers Llc, Allentown, PA (US);

Inventors:

Philip Brunner, East Stroudsburg, PA (US);

Mark Tapsak, Orangeville, PA (US);

Michael Janse, San Jose, CA (US);

Assignee:

ZZYZX POLYMERS LLC, Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 47/40 (2006.01); B29C 47/92 (2006.01); C08L 23/06 (2006.01); B29C 47/00 (2006.01); C08L 23/12 (2006.01); C08K 3/04 (2006.01); B29K 23/00 (2006.01); B29K 401/00 (2006.01); B29K 509/00 (2006.01); B29K 511/00 (2006.01); B29C 47/08 (2006.01); B29C 47/10 (2006.01); B29K 21/00 (2006.01); B29K 63/00 (2006.01); B29K 67/00 (2006.01); B29K 77/00 (2006.01);
U.S. Cl.
CPC ...
C08L 23/06 (2013.01); B29C 47/0004 (2013.01); B29C 47/1081 (2013.01); B29C 47/402 (2013.01); B29C 47/92 (2013.01); C08K 3/04 (2013.01); C08L 23/12 (2013.01); B29C 47/0845 (2013.01); B29C 47/1009 (2013.01); B29C 47/1027 (2013.01); B29C 47/1063 (2013.01); B29C 47/1072 (2013.01); B29C 2947/92704 (2013.01); B29C 2947/92942 (2013.01); B29K 2021/00 (2013.01); B29K 2023/00 (2013.01); B29K 2023/0633 (2013.01); B29K 2063/00 (2013.01); B29K 2067/00 (2013.01); B29K 2067/046 (2013.01); B29K 2077/00 (2013.01); B29K 2401/00 (2013.01); B29K 2509/00 (2013.01); B29K 2511/00 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01); C08L 2207/066 (2013.01); C08L 2207/20 (2013.01);
Abstract

A method for improving the throughput of solid-state shear pulverization and solid-state melt-extrusion devices may include the addition of a heat absorbing material with a mixture of polymeric materials in an extruder. The extruder may include one or more extrusion screws. One or more portions of the one or more extrusion screws, one or more barrel sections, and/or one or more extruder work zones may be temperature controlled to maintain a temperature of the polymeric mixture in contact therewith at or below the liquefication temperature of the polymeric materials. The liquefication temperature may be a melting point of a semi-crystalline polymer or a glass transition temperature of an amorphous polymer.


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