The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Sep. 25, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

SungHo Choi, Daejeon, KR;

Choong Hoon Lee, Daejeon, KR;

JiYoon Woo, Daejeon, KR;

HyoJu Kim, Daejeon, KR;

Jin Sam Gong, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08C 19/25 (2006.01); C08F 210/16 (2006.01); C08L 51/00 (2006.01); C08K 5/132 (2006.01); C08K 5/134 (2006.01); C08K 5/52 (2006.01); C08L 23/08 (2006.01); H01L 31/048 (2014.01); C08L 23/00 (2006.01); C08F 255/02 (2006.01); C08F 8/42 (2006.01); C08L 51/06 (2006.01); H01L 23/29 (2006.01); C08K 5/544 (2006.01);
U.S. Cl.
CPC ...
C08F 210/16 (2013.01); C08F 8/42 (2013.01); C08F 255/02 (2013.01); C08K 5/132 (2013.01); C08K 5/1345 (2013.01); C08K 5/52 (2013.01); C08L 23/00 (2013.01); C08L 23/08 (2013.01); C08L 23/0815 (2013.01); C08L 51/003 (2013.01); C08L 51/06 (2013.01); H01L 23/296 (2013.01); H01L 31/0481 (2013.01); C08K 5/544 (2013.01); C08L 2203/204 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); Y02E 10/50 (2013.01);
Abstract

Provided is an olefin resin composition, and a method of manufacturing an encapsulant for an optoelectronic device, in which the encapsulant exhibits excellent adhesive strength with a back sheet and a front substrate included in various optoelectronic devices. In addition, the encapsulant does not have a bad influence on parts such as optoelectronic units or wiring electrodes encapsulated in an optoelectronic device, and a working environment, and can excellently maintain workability and economic feasibility of device manufacturing.


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