The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

May. 07, 2013
Applicant:

Wacker Chemie Ag, Munich, DE;

Inventors:

Harald Hertlein, Burghausen, DE;

Rainer Hauswirth, Kirchdorf, DE;

Dieter Weidhaus, Burghausen, DE;

Assignee:

Wacker Chemie AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01B 33/02 (2006.01); C23C 16/24 (2006.01); C23C 16/442 (2006.01); C01B 33/03 (2006.01);
U.S. Cl.
CPC ...
C01B 33/02 (2013.01); C01B 33/03 (2013.01); C23C 16/24 (2013.01); C23C 16/442 (2013.01); C01P 2002/90 (2013.01); C01P 2004/03 (2013.01); C01P 2004/45 (2013.01); C01P 2004/50 (2013.01); C01P 2006/12 (2013.01); C01P 2006/80 (2013.01); Y10T 428/2982 (2015.01);
Abstract

Granular polycrystalline silicon includes a compact matrix including radiating acicular crystal aggregates of crystal size from 0.001-200 μm. A process for producing granular polycrystalline silicon includes producing granular silicon in a fluidized bed reactor from a gas mixture containing TCS (20-29 mol %) and hydrogen at a fluidized bed temperature of 900-970° C., dividing the granular silicon in a screen system having at least one screen deck into at least two screen fractions, the smallest screen fraction being ground in a grinding system to give seed particles having a size of 100-1500 μm and a mass-based median value from 400 to 900 μm, and these seed particles being supplied to fluidized bed reactor, and a further screen fraction being supplied to a fluidized bed reactor, and being surface-treated with a gas mixture containing TCS (5.1-10 mol %) and hydrogen at a fluidized bed temperature of 870-990° C.


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